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none

open

40%

49 issues   (20 closed — 29 open)

Issues by
Bug

7/15
Feature

11/23
Support

0/6
Refactoring

0/1
Cleanup

0/1
Documentation

2/2
Other

0/1
Related issues
Bug #405: Lots of warnings when compiling without pci and usb programmers Actions
Bug #408: flashbuses_to_text() may crash flashrom Actions
Bug #410: pico_serprog MT25QL512 Actions
Bug #438: Release v1.4 Actions
Bug #466: Use printf instead of echo -n Actions
Bug #498: DediProg SF600Plus unable to flash W25Q512JV chip Actions
Bug #502: Erase and Write problem with a SST25VF512. Actions
Bug #504: MingW meson build is broken with pre-2019 libraries Actions
Bug #520: Factor out verification from erase path Actions
Bug #551: Segmentation fault 11 when trying to write Actions
Bug #561: Install script can't find cmocka Actions
Bug #570: Fix all the cases when structs are compared with memcmp Actions
Bug #573: Invalid opcode in the logs, erase/write failure Actions
Bug #575: Lenovo Thinkpad w541 - read local not work with 1.5.0-devel Actions
Bug #605: Some write paths verify without respecting --no-verify Actions
Feature #377: Add WP to struct tested Actions
Feature #379: Merging Minipro code for TL866xx programmers Actions
Feature #385: Upgrade unit test mocks for hwaccess functions Actions
Feature #389: programmers can restore pci value in shutdown function Actions
Feature #396: Upgrade board_enable infra for i2c programmers Actions
Feature #403: Encapsulate interaction with flash access Actions
Feature #406: Abstract i2c interface to allow other OSes to work with i2c Actions
Feature #409: If libusb system is too old, build system should not build the programmers which depend on newer libusb Actions
Feature #437: Progress bar Actions
Feature #486: Support installing git hooks with meson Actions
Feature #487: Support building ni845x_spi with meson Actions
Feature #491: spi nand support Actions
Feature #523: Add support for flash Winbond W25N01GV Actions
Feature #526: Add Support for Macronix MX29LV800CT Actions
Feature #541: Adding support for Winbond W25X40CL Actions
Feature #542: Add a member in flashchip struct to indicate that chip is marked as end-of-life by chip manufacturer Actions
Feature #543: Generate the tables of supported flashchips/chipsets/boards in rst format, so that sphinx can convert to html for the website Actions
Feature #544: Make default probe_timing = TIMING_ZERO so that it doesn't need to be set for every flashchip Actions
Feature #545: Split flashchips.c into smaller files, one per manufacturer Actions
Feature #546: Add support for SFDP for probing to differentiate between flash chips with same ID but different capabilities Actions
Feature #568: Investigate maybe we can increase minimum required meson version (revisit in 2027) Actions
Feature #572: Add GD25B127D Chip Actions
Feature #587: Warnings about read-protected regions are shown for the area outside of what was requested with -i Actions
Support #434: Add Winbond W25Q128FW support Actions
Support #442: [$400 Bounty] Add 25N01GVZEIG Winbond WSON 8x6-mm support Actions
Support #454: Add support for MX25L8035E Actions
Support #547: Can't erase Winbond 25Q128JVSQ Actions
Support #564: Cannot Erase/Write Winbond W25Q32.V Actions
Support #566: WP for MX25L25635F (Can't erase nor write) Actions
Refactoring #603: Questions regarding groups/backends/bus refactoring Actions
Cleanup #452: flashrom - meson.build file - update meson_version to >=0.57.0 Actions
Documentation #489: Add packaging and versioning information to README Actions
Documentation #503: Feedback on "new" documentation website <www.flashrom.org> Actions
Other #419: Add automatic spell checking to build bot Actions

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